|Country of Origin||Made in India|
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.of industrial automation. With its sound management, strong technical strength, excellent quality and meticulous and sincere service, the company has a good reputation in the industry.