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BGA Rework Machine

BGA Rework Machine
 
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Approx. Rs 92,000 / SetGet Latest Price

Product Details:
Minimum Order Quantity1 Set
Model Name/NumberDH-390
BrandDinghua Technology
Automation GradeSemi-Automatic
Frequency50hz
Pcb SizeMax 390x370mm Min 20x20mm
Total Power4350W / 4800W
Voltage220v
Weight31kg(approx)

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.

Additional Information:
  • Delivery Time: 2 weeks
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